Heilos Thermal Pads for CPU – Hassle-free Solution

Thermalright has introduced a novel thermal pad, specifically designed to simplify the process of applying thermal paste to a CPU. This new innovation addresses the challenges faced by beginners in DIY PC building, offering them an alternative solution. While thermal pads may not match the peak performance of the finest thermal pastes, their user-friendliness makes them an attractive option.

(Image credit: Thermalright)

Thermalright is renowned for its top-notch CPU heatsinks and diverse range of thermal pastes. However, their latest product, the Heilos thermal pad, is targeted at novice system builders or those who dislike the task of applying thermal paste to a CPU, uncertain of whether they have used the right amount. The Heilos thermal pads discreetly provide a hassle-free solution.

Instead of the conventional thermal paste tube, Heilos presents a 0.2mm-thick thermal compound pad applied directly to the base of your chosen heatsink. While some heatsinks come with pre-applied thermal pads, the quality and condition of these pads can vary significantly, impacting your CPU’s long-term performance.

These user-friendly peel-away applicators offer an appealing alternative for those uncertain about handling traditional thermal paste tubes. After meticulous examination of Heilos specs, Tom’s Hardware has found that these pads provide commendable thermal conductivity performance (8.5 W/mK) and resistance (0.04°C cm²/W), comparable to “affordable” tubes like Arctic MX-4 and MX-5, the latter securing the fourth spot on the publication’s “best thermal pastes” list.

In contrast, certain older thermal pads from other manufacturers have faced criticism for falling short in cooling performance compared to top-rated thermal pastes. Therefore, it’s reassuring to witness Thermalright addressing these concerns through their specifications.

Thermalright identified a clear market need for providing a superior quality pad that ensures ease of use with any CPU/heatsink combination. To meet this demand effectively, they have introduced two distinct versions tailored for AMD and Intel CPUs, accommodating the variations in size between these two platforms.

Heilos Intel Product Description
Specifications:

  • Dimensions:L30 mm x W40 mm x T0.2 mm
  • Thermal Conductivity(W / m-k):8.5 W/mk
  • Color:Gray
  • Thermal Resistance:0.04° cm²/W
  • Resistivity:2.1×10¹⁴ Ω·cm
  • Electrically Conductive:NO
  • Harmless:YES
  • Thickness:0.2 mm
  • Intel:LGA115X/1200/1700
(Image credit: Thermalright)

Heilos AMD Product Description
Specifications:

  • Dimensions:L40 mm x W40 mm x T0.2 mm
  • Thermal Conductivity(W / m-k):8.5 W/mk
  • Color:Gray
  • Thermal Resistance:0.04° cm²/W
  • Resistivity:2.1×10¹⁴ Ω·cm
  • Electrically Conductive:NO
  • Harmless:YES
  • Thickness:0.2 mm
  • AMD:AM4/AM5
(Image credit: Thermalright)

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